Laye |
1-26(layer) |
Max Board size |
AL：600mm*1500mm（24" * 59）" |
|
Duplex：600mm*1200mm（24" * 47）" |
|
Multilayer：600mm*600mm（24" * 24）" |
Copper thick |
0.5OZ-8OZ/18um-280um |
Min Board Thickness |
single：0.1mm—6.0mm/4mil-240mil |
|
2 layer：0.2mm--6.0mm/8mil-240mil |
|
4 layer: 0.4mm-6.0mm /16mil-240mil |
|
6 laye): 0.8mm-6.0mm/32mil-240mil |
|
8 layer: 1.0mm-6.0mm/40mil-240mil |
|
10 layer: 1.5mm-6.0mm/60mil-240mil |
Min line width( sample) |
0.075mm/3mil |
Min space( sample) |
0.075mm/ 3mil |
Min hole size |
0.2mm/8mil |
Machinable maximum thickness to diameter ratio |
10:1 |
Impedance contro |
+/-10% |
Plated wall thickness |
0.025mm/ 1mil |
Plated hole dia tolerance |
±0.125mm/ 5mil |
NO Plated hole dia tolerance |
±0.05mm/ 2mil |
Hole position deviation |
±0.05mm/ 2mil |
Outline tolerance |
±0.15mm/ 6mil |
Min S/M bridge |
0.1mm/ 4mil |
Twist and bent |
≤1.5% |
Peel strength |
1.5N/mm |
Solder mask abrasion |
＞4H |
Thermal stress |
288℃10 3 seconds |
Flammability |
94V-0 |
Test voltage |
50-300V |
Surface treatmen |
HASL |
|
HASL with Pb free |
|
Immersion Gold |
|
Immersion Silver |
|
Flash Gold |
|
Gold Finger |
|
osp |
Special technique |
blind&buried holes,via in pad,Semi-plating holes,countersinked holes |
